Fatigue fracture of SnAgCu solder joints by microstructural modeling

Fatigue fracture of SnAgCu solder joints by microstructural modeling

The ongoing miniaturization trend in the microelectronic industry enforces component sizes to approach the micron, or even the nano scale. At these scales, the underlying microstructural sizes and the geometrical dimensions are comparable. The increasing influence of microscopic entities on the overall mechanical properties makes conventional continuum material models more and more questionable...

Fatigue damage in solder joints

Miniaturisation of electronic products is increasingly important for reasons of functionality enhancement and freedom of design. This is realised by integration into silicon and developing miniature packages with high I/O and power dissipation density. Generally this leads to elevated temperatures, not only in the components but also in the solder joints. Elevated temperature cycling leads to f...

Effect of Au Content on Microstructural Evolution of SnAgCu Solder Joints that Undergo Isothermal Aging and Reliability Testing

Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints

SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Ni/Au-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...

Effects of solder volume on formation and redeposition of Au- containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints

SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...